Ledger Nano X board map

An interactive map of the Ledger Nano X main board: its 40 test pads, the copper traces between them and the chips, and a KiCad reconstruction of the whole board you can explore in 3D.

What is on the board

Test pads

The 40 numbered test pads on the back of the board, as labelled in the photos. Names ending in "?" are likely but not confirmed; the others were measured or follow from what the pad connects to.

Using the photo viewer

• Switch photos: click or Space for front and back, middle-click or E for the board with or without components (the bare board shows copper hidden under parts), right-click or F to mirror. The checkboxes in the panel do the same, for touch screens and Macs.
• Hover (or tap) a trace, test pad or part to see its name, purpose and connections; the whole net lights up, and a trace also shows its route on the other side, dashed.
• Overlays: T shows or hides the traced nets, K the KiCad reconstruction, to compare it with the photos.
• Scroll to zoom, drag to pan, 0 to reset.

Using the 3D viewer

• Drag to rotate, right-drag to pan, scroll to zoom; the Top, Bottom and Angle buttons reset the camera. On a phone or tablet, drag to rotate, pinch to zoom, drag with two fingers to pan, and tap anything for details.
• Hover a track, via or pad to light up its net on both sides, with its purpose and every pad on it. Hover a chip for its description and the net on each of its pins.
• Hide the components, pours or tracks from the panel to see what is underneath.
• Implant overlay: shows how each of three hardware implants found in Nano X devices sits on the board. Specimen C (generation 1) is hand-wired: a small board, a coil antenna and a half-size battery in the case, with fine enamelled wires to the test pads and battery contacts (photos by @Us_Chan007). Specimens A and B were examined by Tibane Labs: A (generation 2) is a translucent Kapton flex laminated over the back of the board and wrapped around its edge to an LTE module and a replacement battery on the front; B (generation 3) is a black-coated flex hidden under the screen with an nRF9151 modem. All are approximate models built from photographs; hover a part for what it is.

How the map was made

• Photos: both sides of one board, with components and with them removed, aligned to the same pixel grid so a point on one photo is the same point on the others (the front photos are mirrored for this).
• Traces: drawn by hand over the photos, segment by segment through every via, and named from datasheets, from what they connect to, and from measurements on the real device.
• Parts: chip pins are computed from each package outline; resistors and capacitors were found automatically from their colour and end caps, then checked by eye; markings were read off the photos.
• Ground: marked as connection points and stitching vias rather than drawn copper, as it is mostly a fill.
• KiCad: a generator turns all of this into a KiCad board and schematic and checks that both carry the same connections. The 3D view and the KiCad overlay are exported from that board.

Caveats

This is a reconstruction from photos, not the manufacturer's design. Positions are accurate to a few tenths of a millimetre; inner copper layers cannot be seen, so the inner ground plane is assumed; footprints are approximate; several parts are not identified yet, and some signal names are inferences, marked with "?" or described as likely. Corrections are welcome.

License

Original reverse engineering work by Karpeles Lab Inc., made available for the public good. The photos, board data and KiCad reconstruction are licensed under CC BY 4.0: reuse them freely, including commercially, crediting Karpeles Lab Inc. The viewers and scripts are under the MIT License. Ledger and Nano X are trademarks of Ledger SAS; this project is not affiliated with Ledger.